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DWL 2000激光直写系统
 
   
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DWL 2000激光直写系统

高速、高灵活度,可自动加载基板,也可装载部分其它系统DWL2000 激光掩模板绘图机高速且灵活的机台;在制作掩模板和无掩模激光直写上拥有高分辨率模组生成程序。直写范围可达 200 mm × 200 mm2。

购买数量:
  (库存9999+)

适用于 MEMS, Bio-MEMS, Micro Optics(微光学), ASICs, Micro Fluidics(微流体力学), Sensors(传感器), CGHs,和要求微结构的其它所有应用。

应用范围:
MEMS、Bio-MEMS、光学相关等行业、需要开发高精度和高分辨率等应用软件。

除了高分辨率 2维模组之外, 系统更进步至创造复杂的 3维结构,在厚实的光阻剂建立单一通道。这个软件特点使定制的微光学, 能很快且容易的以折射或绕射的元素来协助您生产制造。针对这些结构设计的过程,是特别为这种情况而设计转换软体, 来实际支援这些 3维应用。

主要功能:

  • 最大基板尺寸: 200 ×200 mm2
  • 最小描绘尺寸: 0.5 μm
  • 最小描绘网格: 5 nm
  • 4 种描绘模式
  • 进阶 3D 描绘模式
  • alignment 用照相机系统
  • 主机温控防尘罩
  • 选择可能的激光源
  • 光学/空气量规
  • 搭载有 script 的语言功能
  • 多种多样的绘画数据输入格式(DXF,CIF,GDSII,Gerber,STL)
  • 可在线上(Online)传送绘画数据
  • 自动基板加载系统
应用范围
  • MEMS
  • Bio-MEMS
  • Micro Optics
  • ASICs, Micro Fluidics
  • Sensors, CGHs
  • Micro sensor

High Resolution Pattern Generator 

The DWL 2000 and DWL 4000 laser lithography systems are fast, flexible high-resolution pattern generators for mask making and direct writing. With a write area of up to 400 x 400 mm2 these systems are the perfect solution for fast patterning of masks and wafers in MEMS, BioMEMS,Micro Optics, ASICs, Micro Fluidics, Sensors, CGHs, and all other applications that require microstructures.

In addition to high-resolution 2D patterns systems provide a special exposure mode, known as Gray Scale lithography, to create complex 3D structures in thick photoresist. In contrary to other technologies this method enables high throughput formation of 3D microstructures over large areas. Special software tools for optimization and evaluation of Gray Scale exposures have been developed to reduce the cycle time for new products. To ensure lowest surface roughness and shape conformity the systems support up to 4096 gray levels, an unmatched capability in the current market.  Most common applications include fabrication of wafer level optics used for telecommunication or illumination market segments where our systems are being used by some of the largest multinational corporations. Other new applications include display manufacturing as well as device fabrication in the areas of biology and life sciences.     

For additional information please download the Fact Sheet or contact us.

Key Features

  • Substrates up to 400 x 400 mm²
  • Structures down to 0.6 µm
  • Address grid down to 5 nm
  • Multiple write modes
  • Advanced 3D exposure mode
  • Multiple data input formats(DXF, CIF, GDSII, Gerber, STL, BMP)
  • Climate chamber
  • Optical and air-gauge auto focus
  • Scripting capability
  • Online data transfer
  • Stage map correction
  • Camera system for alignment
  • Automatic loading system
  • Customer specific laser