浏览过的商品

DWL 4000激光直写系统
 
   
查看大图

DWL 4000激光直写系统

DWL 4000 产品线包括两种模式,DWL 4000DD 和 可处理更高效能的 DWL 4000FBM。此系统可适用于客制化的激光设备,几乎任何光阻剂都可曝光。让您的制版作业更加得心应手,激光功率不再是您需要担忧的问题。

购买数量:
  (库存9999+)

DWL 4000激光直写系统,电子束(E-Beam)、组件装载模型,大幅度提升绘画的速度DWL4000 激光光绘系统对于公司成本效益、高分辨率的要求、掩模板和基板尺寸。

范围可至 400 mm × 400 mm2 等,DWL 4000 是您最佳的解决方案。DWL 4000 系统利用各式应用软件,把复杂的微构造(micro-structures)做最佳的解决。用来制作Gray Level 构造是一大利器。如:MEMS、SAW Devices、ASICS、MCMs、Integrated Optics and Displays。

主要功能:

  • 最大基板尺寸: 400 ×400 mm2
  • 最小描绘尺寸: 0.5 μm
  • 最小描绘网格: 5 nm
  • 4 种描绘模式
  • 可转换成自动描绘模式 
  • 进阶的 3D 曝光模式
  • 量测/ 校直用照相机系统
  • 选择可能的激光源
  • 可在线上(Online) 传送绘画数据
  • 自动基板加载系统
  • 多种多样的绘画数据输入格式(DXF,CIF,GDSII,Gerber,STL)
  • Stage Map 补正

应用范围:

  • MEMS
  • SAW 设备
  • ASIC
  • MCM
  • integrated optics
  • 显示器

High Resolution Pattern Generator 

The DWL 2000 and DWL 4000 laser lithography systems are fast, flexible high-resolution pattern generators for mask making and direct writing. With a write area of up to 400 x 400 mm2 these systems are the perfect solution for fast patterning of masks and wafers in MEMS, BioMEMS,Micro Optics, ASICs, Micro Fluidics, Sensors, CGHs, and all other applications that require microstructures.

In addition to high-resolution 2D patterns systems provide a special exposure mode, known as Gray Scale lithography, to create complex 3D structures in thick photoresist. In contrary to other technologies this method enables high throughput formation of 3D microstructures over large areas. Special software tools for optimization and evaluation of Gray Scale exposures have been developed to reduce the cycle time for new products. To ensure lowest surface roughness and shape conformity the systems support up to 4096 gray levels, an unmatched capability in the current market.  Most common applications include fabrication of wafer level optics used for telecommunication or illumination market segments where our systems are being used by some of the largest multinational corporations. Other new applications include display manufacturing as well as device fabrication in the areas of biology and life sciences.     

For additional information please download the Fact Sheet or contact us.

Key Features

  • Substrates up to 400 x 400 mm²
  • Structures down to 0.6 µm
  • Address grid down to 5 nm
  • Multiple write modes
  • Advanced 3D exposure mode
  • Multiple data input formats(DXF, CIF, GDSII, Gerber, STL, BMP)
  • Climate chamber
  • Optical and air-gauge auto focus
  • Scripting capability
  • Online data transfer
  • Stage map correction
  • Camera system for alignment
  • Automatic loading system
  • Customer specific laser